Capabilities

Otter's chief PCb products are double-side and multi-layer PCBs, including thru hole, SMT, Blind/sequential & back-drilled vias, impedance controlled, Micro BGA, and photo defined vias and laser defined vias.

LAMINATE
Thickness
(DSB) minimum .010" thk
(DSB) maximum .125"thk
(over-all) MLB 0.2362" thk
Copper weight
minimum 0.3 oz
maximum 6 oz (finished)
Material
Standard Board FR402 / CEM
Burn-in Board  High TG 170, FR406, FR408 (FR5)
UL Rating
94V-0  
 
DRILL
Smallest hole size(Mech.) 5 mils
Laser Drill(Smallest) 3.5 mils
Min. annular ring 3.5 mils
Min. drilled slot 31 X 62 mils
 
CKT/PATTER
Min. line width 4 mils
Min. air gap 4 mils
Min. Internal Clearances 5 mils
Min. Internal Clearances 6 mils
 
PLATING
Nickel plating 80 to 200 u"
Gold (Hard type) 30 u"
Gold (Immersion) 30 u"
Tin/lead (solder) 0.3 mils
Aspect Ratio ^12: 1
 
BOARD FINISH
Immersion gold  
Immersion Tin  
Immersion Silver  
Carbon Ink  
ENTEK (OSP)  
Peelable soldermask  
CONTROL IMPEDANCE  
Blind/Buired Vias (Sequential)  
 
BOARD SIZE
Maximum Board Size 18" x 24"
Maximum Layer count 26
 
TESTING
Electrical
Open and Short  
AOI (MLB)  
Reliability
Peel/Bondability  
Solderability  
Micro section